Innovate Together is a convergence point for industry, academic and research leaders to discuss semiconductor trends and developments, showcase Singapore's growing capabilities in next-generation technologies and demonstrate how collaborative research is essential for solving the hard problems in semiconductor design, manufacturing, and integration.
Join us at Innovate Together 2026 for a full-day forum on the technologies, platforms and partnerships driving the next phase of semiconductor innovation.
Date
25 September 2026
Time
8:00 AM to 6:00 PM
Venue
Resorts World Convention Centre
Entry
Free to Attend
Innovate Together returns for its second year as part of the SSIA Summit, one of Singapore's longest-running gatherings for the semiconductor industry. Together, the two-day programme covers the trends, technologies, and partnerships shaping the future of semiconductors, with Innovate Together shining a spotlight on Singapore's semiconductor R&D ecosystem.
SSIA Summit takes place on Thursday, 24 September 2026, and Innovate Together on Friday, 25 September 2026.
Find out more about the inaugural Innovate Together 2025 edition here. For more on the SSIA Summit, click here.
ORGANISED BY A*STAR, IN PARTNERSHIP WITH SSIA
EVENT HIGHLIGHTS
What to Expect
Executive Perspectives
Hear from technology and business leaders on the technology shifts shaping semiconductors and what they mean for the future of the industry.
Thought-Provoking Discussions
Join candid discussions on the engineering, manufacturing and commercial hurdles that must be overcome to bring next-generation semiconductor technologies to market.
Technology Showcases
Discover how Singapore's semiconductor research is advancing next-generation technologies, with demonstrations of innovations moving from the lab towards real-world deployment.
Networking Opportunities
Meet researchers, manufacturers, technology companies, start-ups and ecosystem partners to explore new collaborations and accelerate innovation together.
SPEAKER HIGHLIGHTS
Who You Will Hear From
Dr Anton HOFMEISTER
Group Vice President General Manager Central R&D APMS Group
STMicroelectronics
Anton Hofmeister is Group Vice President and General Manager of Central R&D for ST’s Analog, Power, MEMS and Sensors (APMS) Group and has held this position since December 2021. He has also served as Managing Director of ST's German subsidiary since 2016.
Hofmeister joined Thomson Semiconductors (a predecessor company to STMicroelectronics) in Munich/Germany in 1986. He subsequently held management positions in product marketing, key account management, and corporate strategic marketing. In 1997, Hofmeister was appointed Director of a System R&D team in San Diego, USA, and became Director of the Print Head Business Unit in 2000. In 2005, he was appointed General Manager of the Microfluidics Division and has broadened his responsibility with the MEMS Actuator Division in 2015, a role he kept until December 2021. During his career, Hofmeister worked for ST in Germany, France, USA and Italy, his current location.
Hofmeister has previously served as a board member of the Singapore-based Molecular Diagnostics company Veredus Laboratories. He is part of the Governing Council of the MEMS& Sensor Industry Group (MSIG) at SEMI and co-chairman of the Board of the European Association on Smart Systems Integration (EPoSS).
Dr CHIU Huang-Jen
CTO, Delta Power and System Business Group
Delta Electronics, Inc
Dr. Huang-Jen Chiu had served as a Distinguished Professor at National Taiwan University of Science and Technology (NTUST) for years. During his tenure, he also held several key leadership positions, including Dean of the College of Industry–Academia Innovation (2024 - 2025), Dean of Research and Development (20211 - 2024), Dean of Industry–Academia Collaboration (2018 - 2022), and Director of the Center for Power Electronic Technologies (2013 - 2021).
In August 2025, Dr. Chiu joined Delta Electronics as Chief Technology Officer (CTO) of the Power and System Business Group (PSBG). In this role, he leads the advancement of next-generation power technologies while actively fostering industry–academia collaboration and talent development, contributing to technological innovation and industrial transformation. In the meantime, he is also an IEEE Fellow, an Editor of the IEEE Journal of Emerging and Selected Topics in Power Electronics, where he continues to support the advancement and dissemination of research in the field of power electronics.
Mr Aloysius CHUA
Chief Executive Officer
MetaOptics
Mr Aloysius Chua, CEO of MetaOptics, an SGX Catalist listed company commercialising metalens technology – ultra-thin, flat lenses that could replace bulky conventional lenses in everything from smartphone cameras to sensors and medical imaging.
Mr Pierre CRAEN
Chief Technology Officer
poLight ASA
Pierre Craen has more than 20 years of experience in opto-mechanical systems engineering. Prior to joining poLight®, he managed product development teams at Varioptic, Barco and Motorola/Symbol. Mr. Craen holds an MSc in Optical Engineering as well as an MSc in Applied Physics.
Dr Patrick LO
Senior Fellow of Technology and Development
GlobalFoundries
Patrick Received PhD/ECE from UT/Austin/USA in 1992. He was with IDT/USA from 1992 to 2004, during which, he was involved in Research and Development in CMOS manufacturing and integration. From 2004 to 2017, he was with IME/A*STAR in Singapore, where he served as the Deputy Executive Director focusing on Research and Development, and had been Program Director of Nanoelectronics/Photonics, TSV, and Emerging memory (RRAM, MRAM), and GaN-on-Si (See below in detail), and Integrated Quantum Photonics, LiDAR, Integrated Neuromorphic Chips. Meanwhile, he was responsible in corresponding business development and strategic pre-competitive partnership development with MNC (incl. tier-1 Foutrane-500 companies) and academics (local, and US/EU, Japan, China).
Since 2017, he, as co-founder, has been with Advanced Micro-Foundry/Singapore focusing on Silicon Photonics’ industrialization. He has (co-) authored > 300 journal and conferences, and holds > 50 granted patents, and he has been given invited talks in many international conference, workshops (incl. OFC panels on Silicon Photonics Industry activities in 2017, 2021, and 2022). He was a recipient of IEEE GES award for Best paper award on their narrow Wire MOS devices (2008), Singapore’s National Technology Award (2008) and President Technology Award (2010).
He was the IEEE JSTQE Guest Editor (GE) for Special Issue on “Silicon Photonics” (2014) and “High Density Integrated Multipurpose Photonic Circuits” (2022), IEEE JSTQE Primary Guest Editor (PGE) for Special Issue on Silicon Photonics and Hybrid-Integration-on-Silicon-Photonics, PIC for AI/ML (2016 & 2022, 2024), and “400G IMDD” (2027), and he is the IEEE JSTQE Senior Editor (2021-Present). And he is the D3 (Active Component) Chair for OFC/2025.
Dr MA Kwok Wai
Senior Principal Engineer, Industrial and Consumer Power
Infineon
Kwok Wai Ma graduated from Hong Kong Polytechnic University, with Bachelor degree in Electronics Engineering and Ph.D. in Power Electronics, in 1988 and 1995 respectively.
He joined Infineon Technologies in 2005 and is currently Senior Principal Engineer, leading all system application engineering activities in Asia Pacific region for Industrial and Consumer Power applications, from product application, application development, technology launch and application innovation, in wide range of appliance, industrial and infrastructure applications. Since 2014 he has led the technology launch activities of SiC power device in Asia.
He has over 40 research papers published and 10 patents granted or pending. He is a senior member of IEEE and received the Top Innovator Award from Infineon Asia Pacific in 2023.
Dr Ionut RADU
Senior Director, Innovation
SOITEC
Ionut Radu is Senior Director, Emerging Technologies at Soitec. He leads the path finding and worldwide partnerships with industrial and academic innovation platforms supporting strategic developments of engineered substrate technologies for semiconductor industry.
Dr. Radu obtained his B.S. and Ph.D in physics from University of Bucharest and Martin-Luther University Halle-Wittenberg respectively. Dr. Radu has 25 years of experience in semiconductor and material development and he has co-authored more than 100 papers in peer-reviewed journals, conference proceedings and reference handbooks and holds 80 patents. Ionut is an IEEE Fellow and he serves on several IEEE conference committees.
Prof TAN Chuan Seng
Professor, Electronic Engineering, School of Electrical and Electronic Engineering
Nanyang Technological University
Chuan Seng Tan is a Professor of Electronic Engineering at the School of Electrical and Electronic Engineering, Nanyang Technological University (NTU), Singapore. He received his PhD from the Massachusetts Institute of Technology (MIT) in 2006. His current research focuses on the process technology of three-dimensional integrated circuits (3D ICs) and engineered substrates (Si/Ge/Sn) for group-IV photonics. He has authored numerous journal and conference publications and holds several intellectual property (IP) rights related to 3D technology and engineered substrates. Notably, nine of his inventions have been licensed to a spin-off company. He has also co-edited and co-authored five books on 3D packaging technology.
He is a Fellow of IEEE (Class of 2022) and a recipient of the Exceptional Technical Achievement Award from the IEEE Electronics Packaging Society (EPS) in 2019. He served as a Distinguished Lecturer for IEEE-EPS from 2019 to 2023. Since 2019, he has also been a Fellow of the International Microelectronics Assembly and Packaging Society (IMAPS) and was awarded the William D. Ashman - John A. Wagnon Technical Achievement Award in 2020.
Prof Aaron THEAN Voon-Yew
Deputy President (Academic Affairs) and Provost, Director, SHINE
National University of Singapore
Aaron Voon-Yew Thean is the GlobalFoundries Professor of Electrical and Computer Engineering at the National University of Singapore (NUS). Currently the Deputy President (Academic Affairs) and Provost of NUS, he was the Founding Dean of NUS College of Design and Engineering (2022), and the Dean of the Faculty of Engineering (2019). Aaron founded the $70M Applied Materials-NUS Corporate Laboratory at NUS in 2018, to co-innovate with US-based Applied Materials on next-generation semiconductor materials. Aaron currently directs the Singapore Hybrid-Integrated Next-Generation μ-Electronics (SHINE) Centre, a National Medium-Sized Research Center funded by the Singapore National Research Foundation (NRF) to innovate on Heterogeneous Integration. In 2016, Aaron was the Vice President of Logic Technologies at IMEC. Aaron graduated from University of Illinois at Champaign-Urbana, USA, where he received his B.Sc. (Highest Honors), M.Sc., and Ph.D. degrees in Electrical Engineering (Edmund J. James Scholar). He has published over 400 technical papers and holds more than 50 US patents. Aaron was recognized as NRF’s Returning Singapore Scientist and more recently, a fellow of the US National Academy of Inventors.
Dr TU Xiaoguang
Distinguished Engineer
Marvell Technology, Inc
Xiaoguang Tu received the Ph.D. degree in microelectronics and solid-state electronics from the Institute of Semiconductors, Chinese Academy of Sciences, Beijing, China, in 2008 major on Silicon photonics. He was a Research Fellow with the School of Electrical and Electronics Engineer, Nanyang Technology University, Singapore and a Research Scientist of Institute of Microelectronics, A*STAR. He joined Inphi Corporation in 2016 which was acquired by Marvell Technology in 2021. He is current a Distinguished Engineer of Marvell and leading the Si-Photonics team in Singapore. His current interests include Si-based optoelectronic devices, circuits and product with heterogeneous integration, advance packaging technology for high-speed AI driven data center interconnect.
Dr Surya BHATTACHARYA
Head, System-in-Package
A*STAR Institute of Microelectronics
Dr. Surya Bhattacharya (Senior Member IEEE) is Head of System-in-Package Department at A*STAR Institute of Microelectronics (IME), Singapore. Over the past 30 years, he has worked on CMOS scaling and Package Scaling at fabless companies, integrated device manufacturer (IDM), and leading Research Institute. At the Institute of Microelectronics, Singapore, Dr. Bhattacharya leads the advanced packaging team to initiate and execute consortia projects to address industry challenges in advanced heterogeneous integration for system scaling. Prior to joining IME, he served as Director of Foundry Engineering at Qualcomm, where he executed technology and manufacturing ramps across multiple foundries around the world. Prior to Qualcomm, he was a Principal Foundry Engineer at Broadcom Corporation. He started his career at Rockwell Semiconductor Systems, Newport Beach, California, where he was Senior Manager for CMOS technology development. Surya has a PhD in Electrical Engineering from the University of Texas at Austin, and B.Tech in Electrical Engineering from the Indian Institute of Technology, Madras.
Dr GONG Xiao
Head, Power Electronics
A*STAR Institute of Microelectronics
Dr. Gong Xiao is currently the GlobalFoundries Chair Associate Professor in the ECE Department of the National University of Singapore (NUS). He is also the Head of Department (Power Electronics) at the Institute of Microelectronics, A*STAR. He obtained his Ph. D Degree from NUS and was a Visiting Scientist at MIT in the year of 2014. His research interest includes advanced transistors and emerging memories for in-memory computing, wide bandgap power electronics, monolithic 3D integration, and opto-electronic integrated circuits and. He has won many awards, including the Bronze Medal at the 6th TSMC Outstanding Student Researcher Award, the Best Student Paper Award at VLSI Symposium (2017, 2021, 2024, 2026), the Best Demo Paper Award at VLSI Symposium (2022, 2023, 2025), the Best Student Paper Award at ICICDT (2019, 2021, and 2023), Emerging Leaders in Journal of Physics D 2021, and NUS Engineering Teaching Excellence Award (2018 and 2023). He has more than 430 publications in international journals and conferences, including more than 120 papers in IEDM and VLSI Symposium. He is the Technical Program Chair in ICICDT (2019, 2022, 2023, 2024) and Sub-committee Chair in ICICDT (2021) and EDTM (2022, 2023, 2025), and in the technical committees of IEDM (2021, 2022), VLSI-TSA (2022, 2023, 2024, 2025, 2026), ECS (2014, 2016, 2018, 2020, 2022, 2024, 2026), ICMAT (2017), EDTM (2017 to 2021, 2023, 2025, 2026), IWJT (2021, 2023), etc. He is the Editor of IEEE Electron Device Letters.
Dr Tony HA Son Tung
Deputy Head, Advanced Optical Technologies Department
A*STAR Institute of Material Research and Engineering (A*STAR IMRE)
Dr. (Tony) Son Tung Ha received his Ph.D degree in Applied Physics from the School of Physical and Mathematical Sciences, Nanyang Technological University (Singapore) in 2018. He currently serves as Principal Investigator and Deputy Head of the Advanced Optical Technologies Department at the Institute of Materials Research and Engineering, A*STAR, Singapore.
He also holds a joint-appointment and leads several flat-optics projects at the National Semiconductor Translation and Innovation Centre (NSTIC). Dr. Ha’s research has been recognized globally with a number of prestigious awards such as Young Individual Research Grant Award (2021, by Singapore); Next ASEAN Innovator (2023, by the Korean Ministry of Science and ITC); Discovery Early Career Researcher Award (2024, by Australian Research Council); and Rising Stars in Optics (2024, by Journal of Optics - IOP Science Publisher, UK).
Dr Arseniy KUZNETSOV
Head, Advanced Optical Technologies Department
A*STAR Institute of Material Research and Engineering (A*STAR IMRE)
Arseniy Kuznetsov is a Senior Principal Scientist and the Division Director of the Optics and Electronics Division at the A*STAR Institute of Materials Research and Engineering (A*STAR IMRE) and Vice President for Flat Optics Platform Technology of the National Semiconductor Translation and Innovation Center (NSTIC). He obtained his double PhD degree at the University of Paris 13 in 2005 and the Institute of Applied Physics of the Russian Academy of Sciences in 2006, and was a research fellow at leading research institutes in Germany and Russia before joining A*STAR in 2011. Kuznetsov’s R&D and management activities are devoted to development of novel nanodevices based on dielectric nanoantennas and metasurfaces. He is an author of >100 journal papers (incl. Science, Nature Nanotechnology etc.) and a co-inventor of >20 filed patent applications. For his pioneering research on dielectric nanoantennas and metasurfaces, he was awarded 2016 IET A F Harvey Engineering Research Prize, 2017 NRF Investigatorship Award and 2020 IPS World Scientific Physics Research Medal and Prize. In 2020 he was also elected to be an Optica Fellow and in 2023 an A*STAR Fellow.
Dr LUO Xianshu
Head, Silicon Photonics
A*STAR Institute of Microelectronics
Dr. Xianshu Luo received his Ph.D. in Electrical and Computer Engineering from HKUST in 2010. He began his career at A*STAR IME, focusing on silicon photonics and heterogeneous optoelectronic integration, and later co-founded Advanced Micro Foundry (AMF) in 2017, where he led the development of silicon photonics platforms and process design kits (PDKs). He returned to IME in 2023 as a Principal Scientist and currently serves as Head of the Silicon Photonics Department at IME and Vice President of Advanced Photonics Platform Technology at NSTIC, leading the development of next-generation multi-material photonics heterogeneous integration technologies.
Dr. Luo is an Optica Fellow, IEEE Senior Member, SPIE Lifetime Member, and PMI member. He has served as Associate Editor or Editorial Board Member for several leading journals, including IEEE Photonics Technology Letters, Optica Photonics Research, Advanced Photonics Nexus, and PhotoniX Synergy. He has also served as Chair, Co-Chair, or Technical Program Committee Member for major international conferences, including the IEEE Silicon Photonics Conference, IEEE Photonics Conference, and OFC. He has authored more than 200 publications, contributed to five book chapters, and holds over 30 patents.
Dr Carlos MAZURE
Chief Strategy Officer
A*STAR Institute of Microelectronics (A*STAR IME)
Dr. Carlos Mazure has been working close to A*STAR as an advisor since May 2021. On July 2024 he joined the Institute of Microelectronics – A*STAR as Chief Strategy Officer.
With 40 years of experience in the global semiconductor industry, Dr. Carlos Mazure is presently member of several international advisory committees and company boards in Singapore and Europe.
Chairman and Executive Director of the SOI Industry Consortium since July 2014 through December 2020. Under his leadership the SOI Industry Consortium has been promoting with the SOI ecosystem the development of the SOI platforms worldwide and helping accelerate the SOI market growth. The SOI Industry Consortium joined the industry association SEMI in January 2021, where Carlos Mazure was an advisor till December 2021.
Carlos Mazure was with Soitec till October 2020. Executive Vice President and Advisor to the CEO since April 2019, and EVP & CTO, Head of Corporate R&D and CTO at Soitec from January 2001 through March 2019.
Prior to Soitec, from 1994 through 2000 Carlos was with Infineon (Munich, Germany), and initiated Infineon/Toshiba FeRAM Alliance in Japan. From 1993 through 1994 he worked for IBM/Infineon DRAM Alliance (Fishkill, NY); and from 1990 through 1993 at Advanced Products Research and Development Laboratory (APRDL), Motorola (Austin, Texas) on BiCMOS ultra fast SRAMs. Carlos started his career at the Siemens Corporate R&D in Munich, Germany, in 1984.
Carlos Mazure is IEEE Fellow, PhD from the Technical University Munich, Germany. Authored/co-authored 120+ technical papers, holds 100+ US patents.
Prof NG Geok Ing
Executive Director
National Semiconductor Translation and Innovation Centre for Gallium Nitride (NSTIC GaN)
Professor Ng Geok Ing received his Ph.D degree in electrical engineering from the University of Michigan, Ann Arbor. Since joining the Nanyang Technological University (NTU) Singapore in the School of EEE in 1995, he has held several key appointments including Head of the Microelectronics Division, Founding Programme Manager of the MMIC Design Centre at the Temasek Laboratories@NTU (TL@NTU) and Director of the Silicon Centre of Excellence (SiCOE). In 2000, he co-founded DenseLight Semiconductor Pte Ltd. which is a NTU spin-off company. Currently, he holds joint appointment with the A*Star Institute of Microelectronics serving as the Executive Director of the National Semiconductor Translation and Innovation Centre (GaN), formerly known as the National GaN Technology Centre (NGTC). He also holds concurrent appointments as the Programme Director of the Centre for Microsystem Technologies (CMT) at the Temasek Laboratories@NTU and the Director of the Centre for Micro- and NanoElectronics (CMNE) in the School of EEE.
His current research specializations include (1) Gallium Nitride (GaN) High-Electron-Mobility Transistors (HEMTs) and (2) III-V compound semiconductor devices for high-frequency and Monolithic Microwave Integrated Circuit (MMIC) applications. He has authored and coauthored more than 300 international journal and conference papers and delivered plenary and invited talks at several international conferences. He holds two granted patents and 5 filed patents.
In 2007, he was awarded the prestigious Singapore’s Defense Technology Prize for his outstanding technological contributions in MMIC R&D. He is also the recipient of the 2023 Singapore Defence Technology Prize – Individual (R&D) Award for the significant technological contributions in building up Singapore’s indigenous R&D capabilities in Gallium Nitride MMIC technologies for defence applications.
Mr Vempati Srinivasa RAO
Head, Heterogenous Integration
A*STAR Institute of Microelectronics
Vempati Srinivasa Rao is the Director and Head of the Heterogeneous Integration Department at the Institute of Microelectronics (IME), Singapore. With over 20 years of experience in advanced semiconductor packaging and integration, he leads the development of next-generation technologies including fine-pitch RDL, TSV interposers, wafer-to-wafer (W2W) and chip-to-wafer (C2W) hybrid bonding for heterogeneous chiplet integration.
His research focuses on fan-out packaging, 2.5D integration, and 3D chip stacking, enabling high-performance semiconductor systems. He has authored or co-authored over 80 journal and conference publications in electronic packaging.
Mr. Rao holds a Master’s degree in Mechanical Engineering (Materials Science) from the National University of Singapore and a Bachelor’s degree in Metallurgical Engineering from NIT Warangal, India.
Prof YEO Yee Chia
Deputy Chief Executive (Innovation & Enterprise)
Agency for Science, Technology and Research (A*STAR)
Professor Yeo Yee Chia leads Singapore's first RIE Flagship in Semiconductors and is A*STAR's Deputy Chief Executive (Innovation & Enterprise), helping to shape the future of one of Singapore's most strategically important industries. He is also Professor of Electrical Engineering at the National University of Singapore (NUS). An award-winning, internationally recognised semiconductor researcher, Professor Yeo has published over 700 research papers and is an inventor of over 400 US patents. More than 40 PhD students graduated under his tutelage.
Recognised with the Singapore Young Scientist Award in 2006 for his research in nanoelectronics and semiconductor devices, Professor Yeo went on to receive the National Research Foundation Fellowship (NRFF) in 2008. The Fellowship enabled him to establish an independent research programme at the National University of Singapore, where he pursued research in strain engineering for next-generation semiconductor manufacturing, deepening his work on transistor technologies aimed at enabling faster and more energy-efficient chips.
His research leadership later took him to TSMC, where he served as Director of Research and Development. Working at the forefront of semiconductor innovation, he co-developed TSMC's industry-leading 7 nm, 5 nm, and 3 nm technologies, which have impacted the world in areas such as high performance computing, artificial intelligence, and consumer electronics.
Supported under the Returning Singapore Scientists Scheme, Professor Yeo returned to Singapore and joined A*STAR in 2022, bringing with him the experience of translating cutting-edge research into industrial innovation at global scale. Drawing on experience across academia, industry and national R&D, he now leads efforts to deepen Singapore's semiconductor capabilities, accelerate research translation, strengthen industry partnerships and nurture the next generation of scientific talent.
Dr ZHU Yao
Head, MEMS
A*STAR Institute of Microelectronics
Zhu Yao is Head of the MEMS Department at IME, A*STAR Singapore, focusing on MEMS for sensing, actuation, and wireless communication. She earned her Ph.D. from Nanyang Technological University in 2015. Zhu Yao is an active IEEE member, serving as associate editor for IEEE MEMS Journal and holding various committee roles. She received the SEMI MEMS & Sensors Industry Group Emerging Leaders Award in 2022.
Dr Mukund SRINIVASAN, Group Vice President & General Manager, Applied Materials
Dr Lena NICOLAIDES, Senior Vice President & General Manager, KLA Corporation
A formal segment featuring remarks from Dr TAN See Leng, followed by ceremonial highlights marking this occasion.
Dr TAN See Leng, Minister for Trade and Industry (Energy and Industry) in the Ministry of Trade and Industry
The next wave of AI performance will not be won at the chip level alone. As models grow more demanding, how chips are connected, cooled, and fed with data is becoming just as consequential as what is on the chip itself. Co-packaged optics, chiplet architectures, and high-bandwidth interconnects have moved from niche concerns to central challenges for the industry. This session explores what it will take to solve them, and what the industry needs to build together to get there.
Dr Surya BHATTACHARYA, Head, System in Package, A*STAR IME
Prof Aaron THEAN, Deputy President (Academic Affairs) and Provost, Director, SHINE, National University of Singapore
The previous session explored how advanced packaging is reshaping AI hardware. This session goes a level deeper, offering a ground-level look at where the technology stands today and where Singapore's programme is taking it.
Mr Vempati Srinivasa RAO, Head, Heterogenous Integration (HI), A*STAR IME
Lunch Break
Sensors and Power Technologies as Key Enablers for A.I.
Dr Anton HOFMEISTER, Group Vice President & General Manager Central R&D APMS Group, STMicroelectronics
Sensing and actuation are the interface between the digital and physical worlds, and the demands on that interface are growing fast. Devices need to be smaller, more precise, and more responsive than ever before.
Singapore's piezoelectric microelectromechanical systems (piezoMEMS) programme is developing capabilities that are already finding their way into real products, through a Lab-in-Fab model that shortens the path from R&D to production. This session explores what Singapore's partnership with STMicroelectronics has made possible, and what it opens up for companies looking to bring piezoMEMS technology to market.
Mr Pierre CRAEN, Chief Technology Officer, poLight ASA
Dr Anton HOFMEISTER, Group Vice President & General Manager Central R&D APMS Group, STMicroelectronics
Dr ZHU Yao, Head, MEMS, A*STAR IME
Silicon photonics faces fundamental material limitations as data rates approach 400G per lane for optical interconnection, including inefficient light sources and limited modulation performance. Photonics heterogeneous integration (PHI) addresses these bottlenecks by integrating best-in-class materials such as III-V semiconductors and lithium niobate onto silicon, enabling superior device performance.
This session will discuss how PHI can unlock scalable, high-speed optical I/O for next-generation AI and datacenter systems. Key topics include trade-offs between performance and manufacturability, material cost, integration complexity, yield, and reliability. The session will also examine pathways for large-scale industry adoption and the ecosystem required to translate PHI innovations into high-volume, deployable technologies.
Dr Patrick LO, Senior Fellow, Technology Development, GlobalFoundries
Dr LUO Xianshu, Head, Silicon Photonics, A*STAR IME
Prof TAN Chuan Seng, Co-Director, NCAIP
Dr TU Xiaoguang, Distinguished Engineer, Marvell Technologies
Metalenses and metasurfaces were, not long ago, a fascinating laboratory result with an unclear path to product. Today they are enabling real applications in AR/VR, automotive sensing, medical imaging, and miniaturised optical systems, and Singapore-based companies are among those making it happen. This session traces the journey from early research to commercial deployment, the challenges along the way, and what the partnership with Singapore's research ecosystem made possible.
Dr Aloysius CHUA, CEO, MetaOptics
Dr Tony HA, Deputy Head, Advanced Optical Technologies Department, A*STAR IMRE
Dr Arseniy KUZNETSOV, Head, Advanced Optical Technologies Department, A*STAR IMRE
Coffee Break
AI hardware, EVs, grid infrastructure, and industrial electrification are placing demands on power electronics that existing silicon can no longer meet. SiC and GaN are emerging as the materials best positioned to close that gap, though moving from device performance to manufacturable, reliable, cost-competitive product still requires the right technology platforms and partners. This session looks at where the technology stands today, the challenges that remain, and what it will take to develop and de-risk next-generation power devices at scale.
Dr HJ CHIU, CTO, Delta Power and System Business Group, Delta Electronics
Dr MA Kwok Wai, Senior Principal Engineer, Infineon
Dr Carlos MAZURE, Chief Strategy Officer, A*STAR
Dr Ionut RADU, Senior Director, Innovation, SOITEC
The previous session mapped the industry landscape and the challenges ahead for SiC and GaN. This session goes a level deeper, offering a ground-level look at Singapore's power electronics programme, the device platforms and process capabilities already in place, and where the roadmap is headed.
Dr GONG Xiao, Head, Power Electronics, A*STAR IME
As 5G matures and 6G moves from concept to reality, the performance demands on RF technology are intensifying. Sensing, defence, and satellite applications are pushing these demands even further, into frequencies and environments where incumbent solutions struggle to keep up. Gallium Nitride (GaN) is the material at the centre of this shift, and Singapore's RF GaN programme is actively working to close the gap between device performance and real-world deployment. This session maps the technical landscape and opens the conversation about where Singapore's capabilities intersect with what industry needs next.
Resorts World Sentosa Convention Centre is accessible by public transport, taxi/private hire and car.
Guests arriving by MRT may alight at HarbourFront Station on the North East Line or Circle Line, then proceed to VivoCity Level 3 to take the Sentosa Express to Resorts World Station.
From Resorts World Station, follow the sheltered walkway and on-site directional signage towards Resorts World Sentosa Convention Centre.
Guests arriving by taxi or private hire may alight at Resorts World Sentosa B1 Drop-Off Point 1 or 2. From the drop-off point, follow the on-site signage and proceed towards the escalators leading to Basement 2.
At Basement 2, follow the marked pedestrian route towards Resorts World Sentosa Convention Centre.
Guests driving to the venue may park at B1 West Car Park and follow directional signage to Resorts World Sentosa Convention Centre. The entrance to the Convention Centre is located at Basement 2. Prevailing car park charges apply.
Be part of the conversation shaping what's next
Join us at Innovate Together 2026 for a full-day forum on the technologies, platforms and partnerships driving the next phase of semiconductor innovation.