Skip to content
Lab‐in‐Fab PMUT Application Student Competition
Brought to you by A*STAR Institute of Microelectronics (IME), STMicroelectronics, IEEE UFFC-S

Turn your PMUT concept into a working demo and present it on the global stage at IEEE International Ultrasonics Symposium (IUS) 2026 (4-8 Oct | Raleigh, NC).

About the Challenge

The Lab-in-Fab PMUT Application Student Competition 2026 invites student teams worldwide to design and demonstrate a system-level PMUT application with measurable performance targets using PMUT devices provided by A*STAR IME. Selected teams will receive real hardware and funding support to build a functional demo, culminating in final evaluation and awards at IEEE International Ultrasonics Symposium 2026 (4-8 Oct | Raleigh, NC).

We are looking for applications that push integration, signal processing, packaging, or end-use performance in meaningful ways.

Application Focus

PMUT (Piezoelectric Micromachined Ultrasonic Transducer)

  • Winners announced at IUS 2026
  • Global visibility within the ultrasonics community

Challenge Flow

Proposal → Top 5 Selected → PCB + PMUT Kit Shipped → Demo Build → Final Evaluation → Awards at IUS 2026 

Support for Top 5 Teams

  • Custom PCB + PMUT chips
  • Device manual and technical documentation
  • IEEE UFFC-S micro-grant (< USD 2,000 per team)

Call For Proposals

We invite student teams to propose a compelling PMUT application focused on:

  • Clear system architecture
  • Defined and measurable performance targets
  • Practical build plan
  • Realistic budget estimate

Proposals should demonstrate technical clarity and feasibility, while showing originality in application integration.

Timeline

25 March 2026
 Call for Proposals opens (templates available for download) 

25 March – 30 April 2026

 Proposal Submission Period 

May 2026

 Selection of Top 5 Teams 

Early June 2026

Kit Distribution
A*STAR IME provides: PCB, PMUT chips (≥5 per team), Device manual, IEEE UFFC-S micro-grant onboarding begins

June – End August 2026

Build & Test Phase
Teams develop working demos and prepare final results package 

First Week of September 2026

Final Evaluation
Judges review demo performance and results 

4 – 8 October 2026

Awards Ceremony at IEEE International Ultrasonics Symposium (IUS) 2026 (Raleigh, NC)

How to Apply

Submit a short proposal slide deck (few pages) using the official application template. 

Required Submission Components:

  • Application concept
  • Target specifications and performance indicators
  • System integration plan
  • Budget estimate

Eligibility

  • Teams of 1–3 students (BSc, MSc, or PhD)
  • Must include a faculty advisor
  • Open to student teams worldwide

Selection Criteria

Proposals will be evaluated based on:

      • Technical feasibility
      • Clarity of system integration
      • Measurable performance targets
      • Innovation and application relevance
      • Budget realism
      • Quality of presentation

Top 5 teams will proceed to the hardware build phase.

Download Application Template

 Access the official slide deck template required for proposal submission.

Download Device Manual

 Review technical specifications, integration guidelines, and PMUT device details.

 

Review Panel

Proposals will be evaluated by technical representatives from A*STAR IME, STMicroelectronics (ST), and an IEEE UFFC-S AdCom member. To preserve the integrity and fairness of the competition, no individual who is part of a submitted proposal will serve on the review panel. 

Submit Proposal

 If the form below is not loaded, you can also fill it in at here

 
Powered by Form

Partners

Hosted By:
• A*STAR Institute of Microelectronics (IME)
• STMicroelectronics
 
 In collaboration with:

• IEEE UFFC-S

output-onlinepngtools

Lab-in-Fab: advancing piezo MEMS technology

Lab-in-Fab is A*STAR IME’s translational R&D platform that embeds research capabilities directly within advanced fabrication environments. By operating in a fab-integrated setting, researchers and industry partners can accelerate process development, device prototyping, and technology validation under production-relevant conditions.

This model shortens the path from concept to manufacturable solution, enabling faster iteration, stronger industry collaboration, and seamless scale-up from research to high-volume manufacturing.