--- title: Lab‑in‑Fab PMUT Application Student Competition 2026 description: Join the Air-Coupled PMUT Student Design Competition to develop innovative applications and showcase your project at the IEEE International Ultrasonics Symposium 2026. image: https://info.ime.a-star.edu.sg/hubfs/Lab%E2%80%90in%E2%80%90Fab%20PMUT%20Application%20Student%20Competition-1.png --- [Skip to content](https://info.ime.a-star.edu.sg/lif-pmut-application-2026#main-content) ![](https://info.ime.a-star.edu.sg/hs-fs/hubfs/NEW_ASTAR_IME_Horizontal_Logo_CMYK.png?width=1077&height=539&name=NEW_ASTAR_IME_Horizontal_Logo_CMYK.png)Homepage ![Lab‐in‐Fab PMUT Application Student Competition](https://info.ime.a-star.edu.sg/hs-fs/hubfs/Lab%E2%80%90in%E2%80%90Fab%20PMUT%20Application%20Student%20Competition.png?width=1232&height=414&name=Lab%E2%80%90in%E2%80%90Fab%20PMUT%20Application%20Student%20Competition.png "Lab‐in‐Fab PMUT Application Student Competition") ###### Brought to you by A\*STAR Institute of Microelectronics (A\*STAR IME), STMicroelectronics, IEEE UFFC-S Turn your PMUT concept into a working demo and present it on the global stage at IEEE International Ultrasonics Symposium (IUS) 2026 (4-8 Oct | Raleigh, NC). [Apply Now →](https://info.ime.a-star.edu.sg/pmut-application-challenge-2026#form) ###### About the Challenge The Lab-in-Fab PMUT Application Student Competition 2026 invites student teams worldwide to design and demonstrate a system-level PMUT application with measurable performance targets using PMUT devices provided by A\*STAR IME. Selected teams will receive real hardware and funding support to build a functional demo, culminating in final evaluation and awards at IEEE International Ultrasonics Symposium 2026 (4-8 Oct | Raleigh, NC). We are looking for applications that push integration, signal processing, packaging, or end-use performance in meaningful ways. ### Application Focus PMUT (Piezoelectric Micromachined Ultrasonic Transducer) - Winners announced at IUS 2026 - Global visibility within the ultrasonics community ### Challenge Flow Proposal → Top 5 Selected → PCB + PMUT Kit Shipped → Demo Build → Final Evaluation → Awards at IUS 2026  ### Support for Top 5 Teams - Custom PCB + PMUT chips - Device manual and technical documentation - IEEE UFFC-S micro-grant (\< USD 2,000 per team) ### Call For Proposals We invite student teams to propose a **compelling PMUT application** focused on: - Clear system architecture - Defined and measurable performance targets - Practical build plan - Realistic budget estimate Proposals should demonstrate technical clarity and feasibility, while showing originality in application integration. ## Timeline ##### 25 March 2026  Call for Proposals opens (templates available for download)  #### 25 March – 15 May 2026  Proposal Submission Period  ### May 2026  Selection of Top 5 Teams  #### Early June 2026 **Kit Distribution** A\*STAR IME provides: PCB, PMUT chips (≥5 per team), Device manual, IEEE UFFC-S micro-grant onboarding begins ### June – End August 2026 **Build & Test Phase** Teams develop working demos and prepare final results package  ### First Week of September 2026 **Final Evaluation** Judges review demo performance and results  ## 4 – 8 October 2026 Awards Ceremony at IEEE International Ultrasonics Symposium (IUS) 2026 (Raleigh, NC) ## How to Apply Submit a short proposal slide deck (few pages) using the official application template.  **Required Submission Components:** - Application concept - Target specifications and performance indicators - System integration plan - Budget estimate **Eligibility** - Teams of **1–3 students** (BSc, MSc, or PhD) - Must include a **faculty advisor** - Open to student teams worldwide **Selection Criteria** Proposals will be evaluated based on: Top 5 teams will proceed to the hardware build phase. ## Download Application Template  Access the official slide deck template required for proposal submission. [Download](https://info.ime.a-star.edu.sg/hubfs/PMUT%20Application%20Challenge/PMUT%20application%20Challenge_Template.pptx?hsLang=en-sg) ## Download Device Manual  Review technical specifications, integration guidelines, and PMUT device details. [Download](https://info.ime.a-star.edu.sg/hubfs/PMUT%20Application%20Challenge/PMUT_Design_Challenge_intro.pdf?hsLang=en-sg)   ### Review Panel Proposals will be evaluated by technical representatives from A\*STAR IME, STMicroelectronics (ST), and an IEEE UFFC-S AdCom member. To preserve the integrity and fairness of the competition, no individual who is part of a submitted proposal will serve on the review panel.  ## Submit Proposal  If the form below is not loaded, you can also fill it in at [here](https://form.gov.sg/69a11c643d3034d01a01f7b6).    Powered by [Form](https://form.gov.sg) ## Partners Hosted By: • A\*STAR Institute of Microelectronics (A\*STAR IME) • STMicroelectronics    In collaboration with: • IEEE UFFC-S - ![NEW\_ASTAR\_IME\_Horizontal\_Logo\_CMYK](https://info.ime.a-star.edu.sg/hs-fs/hubfs/NEW_ASTAR_IME_Horizontal_Logo_CMYK.png?width=1077&height=539&name=NEW_ASTAR_IME_Horizontal_Logo_CMYK.png) A\*STAR Institute of Microelectronics (IME) - ![STMicroelectronics\_2025](https://info.ime.a-star.edu.sg/hs-fs/hubfs/STMicroelectronics_2025.jpg?width=935&height=425&name=STMicroelectronics_2025.jpg) STMicroelectronics - ![uffc-logo](https://info.ime.a-star.edu.sg/hs-fs/hubfs/uffc-logo.png?width=760&height=570&name=uffc-logo.png) IEEE UFFC-S ![output-onlinepngtools](https://info.ime.a-star.edu.sg/hs-fs/hubfs/output-onlinepngtools.png?width=1200&height=667&name=output-onlinepngtools.png) ## Lab-in-Fab: advancing piezo MEMS technology Lab-in-Fab is A\*STAR IME’s translational R&D platform that embeds research capabilities directly within advanced fabrication environments. By operating in a fab-integrated setting, researchers and industry partners can accelerate process development, device prototyping, and technology validation under production-relevant conditions. This model shortens the path from concept to manufacturable solution, enabling faster iteration, stronger industry collaboration, and seamless scale-up from research to high-volume manufacturing. --- © 2026. All rights reserved.