---
title: A*STAR IME at SEMICON SEA
description: Connect with A*STAR IME at SEMICON SEA 2026 to explore advanced semiconductor technologies and partnership opportunities in packaging, photonics, and power electronics.
image: https://info.ime.a-star.edu.sg/hubfs/thana-gu-seV_YKdhSM0-unsplash.jpg
---

![ASTAR\_Horizontal\_Logo\_RGB](https://info.ime.a-star.edu.sg/hs-fs/hubfs/ASTAR_Horizontal_Logo_RGB.png?width=400&height=185&name=ASTAR_Horizontal_Logo_RGB.png "ASTAR_Horizontal_Logo_RGB")

# Meet A\*STAR IME at SEMICON SEA 2026

### **Booth 1472 | 5 - 7 May | MITEC, KL**

- Live technology demonstrations and capability walkthroughs
- Direct access to A\*STAR IME scientists and engineers
- Structured conversations on partnership and co-development models
- Pathways from prototype to production
- Introductions to Singapore's wider semiconductor ecosystem

Let us know your interests and we'll connect you with our dedicated team ahead of SEMICON SEA 2026. 

*Note: Registering here does not guarantee attendance at SEMICON Southeast Asia; event registration is managed separately. *

## Daily Tech Talks @ Booth 1472 ☕

Complimentary coffee & bites at every session

### POWER ELECTRONICS

5 May, 11:00AM, with Toh Ying Ying

### RF GaN

6 May, 11:00AM, with Paul Chia

### SILICON PHOTONICS

5 May, 3:00PM, with Daniel Wee

### MEMS

6 May, 3:00PM, with Tan Wee Ming

The countdown is complete

## Core Capabilities

#### Advanced Packaging

Hybrid bonding and HD-FOWLP enabling chiplet integration with higher density and performance — production-scale infrastructure, not just prototypes.

**→ Hybrid Bonding · HD-FOWLP · Chiplet Integration · 300mm Pilot Line**

### Silicon Photonics

Optical interconnect solutions for AI infrastructure and high-performance computing. High-bandwidth, low-latency data transmission at scale.

**→ Optical Interconnects · AI Infrastructure · HPC**

### Power Electronics

Wide-bandgap device development and integration for high-efficiency power conversion — targeting EV, industrial, and data centre applications.

**→ GaN · SiC · EV · Data Centre · Industrial**

 

#### Flat Optics

Metasurface and metalens platforms enabling ultra-compact optical systems — replacing conventional bulky optics in sensing, imaging, and AR/VR applications.

**→ Metalens · Metasurfaces · Sensing · Imaging · AR/VR**

#### PiezoMEMS

High-sensitivity piezoelectric MEMS platforms for precision sensing, actuation, and energy harvesting — built for miniaturised, high-reliability deployments.

**→ Sensing · Actuation · Energy Harvesting · Biomedical**

### RF GaN

Gallium nitride process development and device design for high-frequency, high-power RF applications across 5G/6G and mmWave.

**→ mmWave · 5G/6G · High-Power RF**

### Integrated Circuit Design

Full-stack IC design capability spanning analog, mixed-signal, and digital circuits — co-developed with process teams to close the loop from design to silicon.

**→ Analog · Mixed-Signal · Digital · Design-Process Co-optimisation**

© 2026. All rights reserved.